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Bussmann Make Semiconductor Fuse NS & SM: Moulded TI2000-BI

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TI2000-BI Semiconductor Fuse

SKU: 0707030048280 Categories: , , Tag:

576.00

Availability:

4 to 6 Weeks

Bussman Make Semiconductor Fuse NS & SM: Moulded TI2000-BI online in India.

Every Spare Parts (ESP) is a dependable contactors and fuses provider in India. We can be counted on for quality contactors and fuses at economical prices. Whether it is fuses or contactors of different capabilities, features and applications, we have you covered.

If you have been looking for Bussmann Semiconductor Fuse NS & SM: Moulded suppliers, your search ends here as you can get the best Bussmann Semiconductor Fuse NS & SM: Moulded suppliers in top cities such as Delhi NCR, Mumbai, Chennai, Bengaluru, Kolkata, Pune, Jaipur, Udaipur, Hyderabad, Surat, Vadodara and Ahmedabad.

You can purchase Bussmann Semiconductor Fuse NS & SM: Moulded of the finest quality and rest assured to get the best in terms of both durability and performance. If you are bothered about the Bussmann Semiconductor Fuse NS & SM: Moulded prices, you can be totally sure to get the best rates as Every Spare Part (ESP) brings you genuine Bussmann Semiconductor Fuse NS & SM: Moulded rates and quality assured products only from the best of brands with exclusive brand discounts you won?t find anywhere else. Procure Bussmann Semiconductor Fuse NS & SM: Moulded today and avail the best offers on your purchase.

Benefits & Applications of Fuses

Fuses are designed to interrupt over currents and break the circuit by melting the element in the fuse. There are two fuses types: AC and DC. AC fuses are also known as high voltages fuses and DC fuses are known as low voltage fuses. Being a reliable fuse provider in India, we stock a wide array of fuses.

PAN India Delivery and Cash on Delivery (COD) available.

Product may differ (eg. colour, appearance) from the product Image displayed on website. Kindly check the technical specifications provided in description to make better purchase decision.

TI2000-BI

Specification: Bussmann Make Semiconductor Fuse NS & SM: Moulded TI2000-BI

HSN Code

Dimensions
Weight 0.43 kg
Dimensions 5.5 × 5.5 × 10 cm

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